FYTECH Company
Suzhou Fanyi Technology Co., Ltd.
Company History
Business Segment
Product Line Up
Strategic Partners
Start material business : Semiconductor material, Electronic material, film. 开始材料业务：半导体材料、电子材料、膜材等。
Start Semiconductor machine and tooling business. 开始半导体设备和配件业务。
Automated semiconductor testing and handling solutions. High-precision test handling systems for reliable IC testing in high-volume production environments.
Precision mold die systems for semiconductor encapsulation. Designed for consistent, reliable packaging across various IC types with high precision tolerances.
Fully automated robotic handling for semiconductor molding processes. Increases production efficiency, reduces manual handling errors, and ensures consistent quality.
High-precision grinding for semiconductor strip processing. Delivers excellent surface quality and consistent material removal rates for high-volume production.
Clean semiconductor mold for continuous production. Release sheet to protect and lubricate mold, improve production capacity.
Clean semiconductor mold, high efficiency to remove compound residue during assembly.
Can be coated with a constant wall thickness to uneven surface such as a printed circuit board, provide long-term and reliable protection of sensitive circuits.
Molding, Ag Sintering等工艺应用，用于保护产品或者芯片。
公司能为客户的各种产品，如LGA, QFP, QFN, SOP, BGA ,Flip chip……提供良好的设计方案。
公司严格按照EIA481标准设计和生产载带，自主开发CCD检测系统，确保产品质量。
Grind wafer to customer's target thickness, high performance of roughness and long life time.
